Samtec XCede® HD HDTM 1.8mm Vertical Backplane Headers
Samtec XCede® HD HDTM 1.8mm Vertical Backplane Headers feature a 1.8mm column pitch, keying, guidance, and up to 3mm contact wipe on signal pins. These headers consist of three levels of sequencing that enable hot-plugging and are available in 3-, 4-, and 6-pair designs with 4, 6, or 8 columns. Samtech HDTM headers are designed using liquid crystal polymer (LCP) housing material and phosphor bronze contact material. These RoHS-compliant headers operate at -40°C to +105°C temperature range. The XCede HD HDTM vertical backplane headers mate with the XCede HD HDTF right-angle backplane receptacles.
Features
- 3-, 4-, and 6-pair designs
- 4, 6, or 8 columns
- Three levels of sequencing enable hot-plugging
- 3mm contact wipe on signal pins
- Integrated guidance, keying, and polarizing side walls available
- LCP insulator material
- Phosphor bronze contact material
- -40°C to +105°C operating temperature range
- RoHS compliant
Dimensions (mm)
Accessories
Associated Connectors
Samtec XCede® HD HDTF Right-Angle Backplane Receptacles
Features a 1.8mm column pitch and modular design for flexibility in applications.
Samtec XCede® HD High-Density Backplane Systems
Combine a small form factor with incredible design flexibility for system and board space savings.
Samtec XCede® HD HPTS 3.20mm Power Modules
Feature press-fit tails and come in a variety of body heights to match signal module pair count.